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    Model TZDI-6 TZDI-12 TZDI-20 TZDI-25 TZDI-35
    Substrate size 630×660 mm 630×810 mm 550×810 mm 530×850 mm 630×810 mm
    Substrate thickness 0.025-5.0 mm 0.02-5.0 mm 0.05-5.0 mm 0.05-5.0 mm 0.05-5.0 mm
    Limit 6 μm 12 μm 20 μm 25 μm 35 μm
    MP analysis 12 μm 20 μm 35 μm 40 μm 50 μm
    Line width accuracy ±10% ±10% ±10% ±10% ±10%
    Alignment accuracy ±6μm ±8μm ±8μm ±12μm ±12μm
    Lnterlayer alignment accuracy 10 μm 16 μm 24 μm 24 μm 24 μm
    Maximum capacity 20mj / s @30 20mj / s @14 20mj / s @8 20mj / s @8 20mj / s @8.5
    Recommended application IC substrate IC substrate,SLP HDI,MLB,FPC PCB, FPC MLB (inner and outer layer) ceramic substrate
    Model TZUVDI-20 TZUVDI-35
    Substrate size 600×660 mm 609×810 mm
    (550×610 mm, 630×810 mm)
    Substrate thickness 0.05-5.0 mm 0.05-5.0 mm
    Minimum window 50 μm 100 μm
    Minimum resistance welding bridge 50 μm 75 μm
    Line width accuracy ±10% ±10%
    Alignment accuracy ±12μm ±12μm
    Lnterlayer alignment accuracy 24 μm 24 μm
    Maximum capacity 50seconds / face @ 300MJ 12 seconds / face @ 300MJ
    Recommended application Soft board and hard board anti welding, inner and outer circuit Soft board and hard board anti welding, inner and outer circuit
    Other / 415nm light source is selected for white oil application
    Model TZDI-25R
    Substrate size 250×2400 · 520×2400 mm
    Substrate thickness 0.02-0.25 mm
    Limit 25 μm
    MP analysis 40 μm
    Line width accuracy ±10%
    Alignment accuracy ±30@260×1200μm
    Maximum capacity 3m/min@20mj/cm2
    Recommended application FPC
    Model TZLUVDI-35
    Substrate size 630×810 mm
    Substrate thickness 0.05-5.0 mm
    Minimum window 100 μm
    Minimum resistance relding bridge 75 μm
    Line width accuracy ±10%
    Alignment accuracy ±12μm
    Lnterlayer alignment accuracy 24 μm
    Maximum capacity 10.5s /face @ 500mj/cm2 15s / face @ 1000mj/cm2
    Recommended application Soft board and hard board anti welding, inner and outer circuit
    Training certificate query
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