TZTEK AVI-M series Visual Inspection Equipment combines many technologies, such as TZTEK optical detection, independent Cam analysis and AI deep learning, and combines traditional algorithms with AI algorithms to effectively perform false point filtering. It has a variety of resolutions, can adapt to different application scenarios, and can be widely used in the appearance detection of PCB, FPC, and 5G ceramic carrier plates.
| Model | AVI-M15C | AVI-M10C | AVI-M05C | AVI-M035C | |
| CCD resolution（μm/pixel） | 15 | 10 | 5 | 3.5 | |
| External dimensions（mm） | 1962×1490×1820（L×W×H） | ||||
| Equipment weigh（t t） | 1.1 | ||||
| Equipment powe（r Vac,Hz,KW） | 380， 50，7 | ||||
| Processing method | Manual loading and unloading | ||||
| Inspection area(mm) | 600×600（MAX） | ||||
| CT（s/side） | 24（ Take 430×250 mm product with 10 μm resolution as an example） | ||||
| Detection board thickness(mm) | 0.06-2 | ||||
| Defect confirmation | AVI online confirmation + VRS fission confirmation | ||||
| Defect range | Substrate inspection: finger burrs, copper slag Text inspection: missing printing, incomplete Circuit inspection: notch, bump copper, oxidation, indentation, pinhole Gold surface inspection: scratches, heterochrome, exposed copper, oxidation, finger migration (measurement) Reinforcement inspection: missing, defects, foreign matter, burrs, air bubbles, finger migration (measurement) PAD inspection: scratches, oxidation, heterochrome, exposed copper CVL inspection: deviation, foreign matter, breakage Shielding film inspection: deviation, breakage Poor punching:deviation (measurement, inspection) Drilling inspection: porous, few holes, hole deviation, hole-filling, hole ring too thin Ink: exposed copper, dirty, scratched | ||||
| Applicable board range | Suitable for HASL board, immersion gold board, gold-plated board, immersion silver board, immersion tin board, OSP anti-oxidation board, etc. | ||||
| Temperature and humidity | 22±2℃ ， 50±10% | ||||
